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LED Equipment

UV LED - High Temp MOCVD

(Phaethon 100U UV MOCVD)
The system for mass production of UV LED chips.
High temperature processing (over 1400℃) is possible.
  • HTLF (High Temperature Leak Free Showerhead)
    (Vertical Gas Injection Type / Stainless steel)
  • SBCTM (Susceptor Bake Chamber)
  • TaC coated graphite susceptor
  • Capacity : 6 x 2”
    8 x 4 ”& 4 x 6” (under development)
  • RF induction heating
  • Water cooled Induction coil with profile adjustment
  • Temperature control : ≥1400℃ measured and controlled by Pyrometer
  • Typical process pressure : 30 ~ 600Torr

Blue / Green LED - MOCVD

(Phaethon 200D GaN MOCVD)
The system with high productivity and cost effectiveness available for epitaxial development.
  • Cluster type : dual reactor
  • Capacity : 90 x 2”, 18 x 4”, 8 x 6”
  • RF induction heating
  • Highest throughput and yield
  • Full automation loading / unloading system
    (cassette to cassette)
  • Easy operation and low maintenance cost

ICP Etcher (Manual)

(HiEtch LXC-380M)
The system has excellent selectivity, etch rate and uniformity.
  • Capacity : PSS → 27 x 2”, 7 x 4”, 3 x 6” GaN → 33 x 2”, 8 x 4”
  • Good process uniformity : WIW, WTW, RTR < 3%
  • Reliable process and easy maintenance
  • High throughput : over 25,000pcs / month (based on 2”)

ICP Etcher (Cassette)

(HiEtch LXC-380C)
The system is an automation equipment containing cassette and TM chambers which can automatically load up to 5 trays to improve the process efficiency.
  • Capacity : PSS → 27 x 2”, 7 x 4”, 3 x 6” GaN → 33 x 2”, 8 x 4”
  • TM Chamber : 4 side aluminum material chamber with Lid for Tray
  • Buffer Chamber : 2 slots aluminum material chamber
  • L/L Chamber : aluminum material chamber (ATM)
  • Cassette : 5 slots aluminum cassete (Fixed type)
  • Mechanism : Tray transportation using a vacuum robot

ICP CVD (Cluster)

(HiDep LX-200D )
Equipped with dual chambers for high productivity,
it can perform filming and depositing processes
under 100℃ and provide LPCVD level filming
quality at above 300℃.
  • Cassette Loading System with 200mm Wafers / Trays
  • Cluster System for 6” Wafers
  • 6” Electrostatic Chuck (Ceramic) for Low Temperature Process
  • High Temperature Process using Electro-resistive Heater

PECVD (Plasma Enhanced CVD)

(HiDep LX-340)
The system is an automated loading systems for the passivation and the hard mask sealing processes.
It is appropriate for manufacture of low-cost
LED chips.
  • Deposition of SIO2, SiN films below 400° for passivation and hard mask
  • Automation loading system
  • Capacity : 27 x 2”, 7 x 4” & 3 x 6”